Changes between Version 23 and Version 24 of Hardware/hNodes/cNodeVer3/dAssembly


Ignore:
Timestamp:
Jun 19, 2013, 12:16:25 AM (11 years ago)
Author:
ssugrim
Comment:

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  • Hardware/hNodes/cNodeVer3/dAssembly

    v23 v24  
    22[[TOC(Hardware,Hardware/hNodes*, depth=5)]]
    33
    4 Assembly process consist of:
    5 
    6  * General Assembly
    7   * [wiki:Hardware/hNodes/cNodeVer3/dAssembly/aCase Case]
    8   * [wiki:Hardware/hNodes/cNodeVer3/dAssembly/bCM CM]
    9  * Specific Pages
    10   * LV-678
    11   * LV-67B
    12   * [wiki:Hardware/hNodes/cNodeVer3/dAssembly/aLV67C LV-67C]
    13   * LV-67F
    14   * [wiki:Hardware/hNodes/cNodeVer3/dAssembly/aaLV67G LV-67G]
    15 
    16 * [wiki:Hardware/hNodes/cNodeVer3/dAssembly/4MobNode 4 Node Group]
     4A fully functional test bed requires several nodes. To assemble the node has 3 major components (and 1 optional):
     5 1. Case
     6 1. CM
     7 1. Mother board bios
     8 1. Wifi/Wimax cards and other peripherals