Changes between Version 11 and Version 12 of Hardware/jCM/bCM1/aHardware


Ignore:
Timestamp:
Dec 19, 2011, 7:16:19 PM (12 years ago)
Author:
Ilya Chigirev
Comment:

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  • Hardware/jCM/bCM1/aHardware

    v11 v12  
    1 == Hardware Description ==
     1=== Hardware Description ===
    22
    33Chassis Manager (CM) is organized around RCM3700 module and comes in two incarnations:
    … …  
    1717Table 2 CM I2C Components
    1818
    19 === Node module ===
     19==== Node module ====
    2020
    21 === PCI MOdule ===
     21==== PCI MOdule ====
    2222
    2323The CM has two components:  a CM PCI card that connects directly to the host, and a NodeIDBox that permanently mounts on a fixture at each grid position.  The PCI CM block diagram is shown in Figure 5. 
    … …  
    2727The physical form-factor for the Chassis Manager is a 2U PCI card measuring approximately 4.75 x 2.5 in.  The Node ID box is on a board measuring approximately 2.25 x 1.75 in.  Appropriate sockets permit the RCM3700 module to plug directly into the PCI card or optionally through a 10 pin ribbon cable for remote mounting.
    2828
    29 === Major Hardware Components ===
     29==== Major Hardware Components ====
    3030
    31 ==== RCM3700 ====
     31===== RCM3700 =====
    3232
    3333[[Image(RCM3700.jpg,align=right,title="Rabbit Semiconductor RCM 3700",200)]]
    … …  
    4848Note:  The Dynamic C TCP/IP library functions are slightly different from Unix syntax, and are not directly portable to non-Rabbit platforms.
    4949
    50 ==== DS1780 ====
     50===== DS1780 =====
    5151
    5252[[Image(DS1780.jpg,align=right,title="DS1780 Functional Block Diagram",200)]] Voltage and temperature monitoring is achieved using the I2C-based Dallas Semiconductor DS-1780.  This device is a 24-pin direct-to-digital chassis system monitor.  It is capable of monitoring ambient temperature, six power supply voltages, and the speed of two fans.  Fan speed can also be controlled from this device using an internal 8-bit ADC. 
    … …  
    5454[[BR]][[BR]][[BR]][[BR]][[BR]][[BR]]
    5555
    56 ==== TPIC2810 ====
     56===== TPIC2810 =====
    5757
    5858[[Image(TPIC2810.jpg, align=right, title="TPIC2810 Block Diagram",200)]]
    … …  
    6060[[BR]][[BR]][[BR]][[BR]][[BR]][[BR]]
    6161
    62 ==== P82B96 ====
     62===== P82B96 =====
    6363
    6464[[Image(P82B96.jpg,align=right,title="P82B96 Block Diagram",200)]]
    … …  
    6767[[BR]][[BR]][[BR]][[BR]][[BR]][[BR]]
    6868 
    69 ==== PCA9554 ====
     69===== PCA9554 =====
    7070
    7171[[Image(PCA9554.jpg,align=right,title="PCA9554 Block Diagram",200)]]
    … …  
    7474[[BR]][[BR]]
    7575
    76 ==== PCA8581 ====
     76===== PCA8581 =====
    7777
    7878[[Image(PCA8581.jpg,align=right,title="PCA8581 Block Diagram",200)]]
    … …  
    8181[[BR]]
    8282
    83 ==== PCF8570 ====
     83===== PCF8570 =====
    8484
    8585The 256 x 8 PCF8570 I2C RAM device is included in the CM design for future use, and is not used on the initial CM boards.  Its design consideration addresses inter-processor communication between the CM and the Host node.
    8686
    87 ==== I2C Address Map ====
     87===== I2C Address Map =====
    8888The address assignments of the CM I2C components were selected to avoid address collision with the same class of device on a host system.  While this can not be guaranteed for all host systems, those hosts that are likely to be connected to a CM were considered.
    8989